Alpha OM340 is a lead-free, no cleaning solder paste with SAC305 composition of Sn96.5Ag3.0Cu0.5.

Alpha OM340 achieves excellent anti headrest defect performance and qualified yield in the industry through online testing. OM340 is particularly suitable for applications with ultra-fine spacing repeatability (11mil) and high yield requirements. In the reflow process window, it ensures ideal coalescence on CuOSP materials with various deposition sizes, and excellent performance in preventing the generation of random solder balls and tin beads.