Description: The BGA360 series hidden solder joint inspection system solves the problem of hidden solder joints in printed boards that cannot be directly observed. It is specifically designed for quick inspection of hidden solder joints and pins of precision devices (such as BGA, CSP, QFP, SMD, densely pin connectors, etc.). BGA360 series hidden solder joint inspection system is a good tool for supplementary inspection of X-RAY equipment, which can compensate for the morphology, roughness, cracks and other problems that cannot be observed by X-RAY. At the same time, it can quickly observe defects such as excessive tin, insufficient tin, short circuits, open circuits, cracked solder joints, and excess materials, save pictures and record videos, and assist with size measurement and annotation functions.

The BGA360 is equipped with a sturdy gantry style bracket and platform, with movable X-Y-Z axes and precision micrometers for precise adjustment. The optional observation prism has two types of parallel and vertical views, and the size can meet a spacing of 0.5mm.